TSMC

The article highlights advancements in environmentally friendly extraction of rare earth minerals, TSMC's plans to construct ten 2nm fabrication facilities, and the installation of a Bell-1 Quantum Computer by Equal1 at the ESA’s Φ-lab. These developments reflect significant trends in sustainability, cutting-edge technology, and the ongoing evolution of semiconductor manufacturing.

SemiWiki

Accelerating SRAM Design Cycles: MediaTek’s Adoption of Siemens EDA’s Additive AI Technology at TSMC OIP 2025

Dec 02, 2025

MediaTek is leveraging Siemens EDA's Additive AI Technology to enhance SRAM design cycles, which is crucial for mobile System-on-Chip development. SRAM constitutes a significant portion of chip area, impacting both yield and performance.

SemiAnalysis

TSMC Overseas Fabs – A Success?

Nov 30, 2025

The article discusses Morris Chang's predictions regarding the failure of U.S. semiconductor fabs and compares the wafer cost and economic advantages of Taiwan's fabs over those in the U.S. It also provides insights into TSMC's supply chain dynamics.

1

SemiWiki

TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel

Nov 28, 2025

TSMC has initiated legal proceedings against former Senior Vice President Wei-Jen Lo for allegedly transferring trade secrets to Intel. This situation highlights a complex rivalry between TSMC's leadership and Intel's strategic maneuvers.

Electronics Weekly

TSMC to build ten 2nm fabs in Taiwan

Nov 28, 2025

TSMC is increasing its planned number of 2nm fabs in Taiwan from seven to ten, according to reports from Liberty Times. This expansion indicates a significant commitment to advanced semiconductor manufacturing in the region.

SemiWiki

Modern Trends in I/O and ESD Design at TSMC OIP

Nov 26, 2025

The TSMC OIP Ecosystem Forum highlighted the significant evolution of semiconductor I/O design over the past 25 years, transitioning from basic GPIO cells in 180nm nodes to advanced, multi-protocol libraries in 16nm and 22nm nodes. This transformation reflects the increasing complexity and capability required in modern semiconductor applications.

Tom's Hardware

TSMC sues former executive over defection to Intel, says it's highly likely he stole trade secrets — chipmaker claims Wei-Jen Lo broke non-disclosure and non-compete agreements

Nov 25, 2025

TSMC has filed a lawsuit against former executive Wei-Jen Lo for allegedly violating non-disclosure and non-compete agreements after he joined Intel. The chipmaker claims it is highly likely that he stole trade secrets during his transition.

Tom's Hardware

TSMC says advanced‑node capacity falls ‘about three times short’ of AI demand — company's wafer capacity is 'still not enough' as demand continues to rise

Nov 25, 2025

TSMC's Chairman-CEO C. C. Wei has stated that the company's advanced-node wafer capacity is currently about three times less than what major customers are expected to require. This shortfall indicates a significant gap between supply and demand in the semiconductor market, particularly for advanced nodes.

EE Times

A Power Reshuffle Follows GF, TSMC GaN Tie-Up

Nov 24, 2025

TSMC has licensed its GaN technology to GlobalFoundries (GF) as it exits the power semiconductor market, leading to a significant shift in the U.S. power semiconductor landscape. This move highlights the evolving dynamics between major players in the semiconductor industry.

Tom's Hardware

Taiwan set to avoid 'punishing' 300% tariffs on semiconductor exports, says report — new trade deal could spur $400 billion investment commitment from island nation

Nov 21, 2025

Taiwan is set to avoid a significant 300% tariff on its semiconductor exports as part of a new trade deal with the U.S. This agreement involves Taiwan assisting the U.S. in replicating its successful science park model for technology companies.

Tom's Hardware

Intel CEO rejects reports the company is obtaining TSMC secrets from former executive — Taiwan's investigation into Intel's controversial recent hire continues

Nov 21, 2025

Intel CEO Lip-Bu Tan has dismissed rumors that the company's recent hire of former TSMC executive Wei-Jen Lo involved the transfer of proprietary TSMC process secrets. The ongoing investigation in Taiwan into this matter continues to raise questions about corporate ethics in the semiconductor industry.

Tom's Hardware

Microsoft unveils Azure Cobalt 200 CPU, in-house chip targets higher performance and deeper integration — Arm-based chip is equipped with 132 cores and manufactured using TSMC's 3nm process

Nov 20, 2025

Microsoft has introduced the Azure Cobalt 200, a new in-house server processor featuring 132 cores and based on Arm architecture. This CPU is manufactured using TSMC's cutting-edge 3nm process technology.

Semiconductor Engineering

Overcoming BEOL Patterning Challenges At The 3nm Node

Nov 20, 2025

The article discusses the use of virtual fabrication techniques to evaluate edge placement errors and successfully pattern 18nm metal pitches at the 3nm node. This advancement addresses critical challenges in back-end-of-line (BEOL) processing as semiconductor technology continues to scale down.

r/chipdesign

SERDES - Scramblers in the era of PAM4 signals

Nov 19, 2025

The article discusses the challenges of scrambling PAM4 signals in PCIe Gen 6, questioning the effectiveness of using LFSRs for this purpose and the assumption of uncorrelated output streams. It highlights concerns about the probability distribution of the scrambled signals.

r/chipdesign

What is CTLE in Serdes System

Nov 19, 2025

The article discusses the role of Continuous Time Linear Equalizers (CTLE) in Serializer/Deserializer (SerDes) systems, highlighting their importance in reconstructing distorted data streams at high speeds. CTLE is presented as a common equalization approach used in both transmitting and receiving circuits.

r/chipdesign

Help(I'm a beginner)

Nov 19, 2025

The article features a beginner seeking guidance in chip design, highlighting the challenges faced by newcomers in the semiconductor industry. It serves as a platform for sharing knowledge and resources among enthusiasts and professionals.

r/chipdesign

Feeling stuck in current layout role, any advice?

Nov 19, 2025

The author expresses frustration with their current layout role, citing a challenging work environment with increased project demands and a lack of automation tools. They feel their performance evaluation does not accurately reflect the circumstances affecting their productivity.

3D InCites

IFTLE 646: TSMC 3Dblox 2.0 Helps Advanced Packaging Designs

Nov 19, 2025

The 3Dblox open standard, introduced by TSMC in 2022, is evolving to enhance the modeling of physical stacking and logical connectivity for 3D IC designs. This update aims to simplify the design process by providing a comprehensive view of connectivity in a unified format.

r/chipdesign

Top Computer Architecture Universities in the US?

Nov 18, 2025

The article discusses the rankings of top computer architecture universities in the US, highlighting institutions like Berkeley, MIT, and others. It seeks to clarify the relative standings of various universities known for their engineering programs.

Vik's Newsletter

An In-Depth Look at the Viability of X-rays as an Alternative to EUV Lithography

Nov 03, 2025

Substrate, a California startup, aims to challenge industry giants TSMC and ASML by utilizing X-rays for patterning at leading-edge nodes below 2nm. The viability of this technology raises questions about its potential impact on existing lithography methods.

Browse

Hot Topics

What caught your eye? (Wastewater Rare Earths, TSMC 2nm, Quantum computer)

Accelerating SRAM Design Cycles: MediaTek’s Adoption of Siemens EDA’s Additive AI Technology at TSMC OIP 2025

TSMC Overseas Fabs – A Success?

TSMC Formally Sues Ex-SVP Over Alleged Transfer of Trade Secrets to Intel

TSMC to build ten 2nm fabs in Taiwan

Modern Trends in I/O and ESD Design at TSMC OIP

TSMC sues former executive over defection to Intel, says it's highly likely he stole trade secrets — chipmaker claims Wei-Jen Lo broke non-disclosure and non-compete agreements

TSMC says advanced‑node capacity falls ‘about three times short’ of AI demand — company's wafer capacity is 'still not enough' as demand continues to rise

A Power Reshuffle Follows GF, TSMC GaN Tie-Up

Taiwan set to avoid 'punishing' 300% tariffs on semiconductor exports, says report — new trade deal could spur $400 billion investment commitment from island nation

Intel CEO rejects reports the company is obtaining TSMC secrets from former executive — Taiwan's investigation into Intel's controversial recent hire continues

Microsoft unveils Azure Cobalt 200 CPU, in-house chip targets higher performance and deeper integration — Arm-based chip is equipped with 132 cores and manufactured using TSMC's 3nm process

Overcoming BEOL Patterning Challenges At The 3nm Node

SERDES - Scramblers in the era of PAM4 signals

What is CTLE in Serdes System

Help(I'm a beginner)

Feeling stuck in current layout role, any advice?

IFTLE 646: TSMC 3Dblox 2.0 Helps Advanced Packaging Designs

Top Computer Architecture Universities in the US?

An In-Depth Look at the Viability of X-rays as an Alternative to EUV Lithography