The article discusses a webinar on Defacto's SoC Compiler AI, which aims to simplify the complex process of System-on-Chip design by utilizing human language. This innovation addresses the challenges posed by intricate EDA tool flows that often lead to significant time losses in configuration.
The BrainScaleS-2 SoC combines analog neuron and synapse circuits with digital components, including CPUs and FPGA connectivity, to enhance neuromorphic computing. It achieves low chip-to-chip latencies through a sophisticated interconnection system, enabling efficient data processing in a compact rack format.
MediaTek is leveraging Siemens EDA's Additive AI Technology to enhance SRAM design cycles, which is crucial for mobile System-on-Chip development. SRAM constitutes a significant portion of chip area, impacting both yield and performance.
Ceva, Inc. is collaborating with United Micro Technology to develop a 5G RedCap System-on-Chip (SoC) aimed at enhancing connectivity in automotive technology. This partnership highlights the increasing necessity for reliable communication as vehicles evolve into intelligent nodes within a broader ecosystem.
The article discusses the challenges faced by SoC projects due to increased design and verification complexity, indicating that traditional methods of adding resources are insufficient. It suggests that smarter approaches are needed to enhance verification efficiency.
The article presents a chiplet-based RISC-V SoC architecture designed to enhance performance and efficiency for edge AI devices. It introduces four key innovations aimed at overcoming the limitations of traditional monolithic SoC designs.
The webinar discusses the challenges and considerations in designing system-on-chip (SoC) architectures, particularly in the context of increasing demands from AI workloads. It highlights the need for high bandwidth, low latency, and energy-efficient data movement in heterogeneous systems.
The EFR32xG24 Channel Sounding Dev Kit from Silicon Labs is a versatile and affordable platform designed for low-power IoT applications. It features essential components such as dual antennas and an onboard debugger, making it suitable for developers working with Wireless Gecko EFR32MG24 SoCs.
The article discusses the importance of automated IP checking in the design of advanced System on Chips (SoCs). It emphasizes the need for securing intellectual property integrity in this complex design process.
A final year Electronics and Communication Engineering student is seeking job and internship opportunities in Digital VLSI, highlighting their proficiency in EDA tools and hands-on experience with Edge AI SoCs. They have also worked on various architectures and low-power design techniques.
A group of students is seeking innovative ideas for their RISCV SoC project to enhance performance as part of a tapeout experience. They are looking for suggestions that could differentiate their design.
Qualcomm has unveiled its Snapdragon X2 Elite Series, showcasing its latest ARM-based SoC for Windows PCs during an Architecture Deep Dive event in San Diego. The Snapdragon X2 Elite Extreme is highlighted as the top-of-the-range offering, promising enhanced performance for ARM notebooks.
The article discusses the relevance of PCIe 3.0 for certain applications, emphasizing that not all SoC designs require the latest PCIe protocols like 5.0 or 6.0. It highlights the trade-offs in power, complexity, and cost that come with adopting cutting-edge technologies.
RAAAM has secured $17.5 million in Series A funding to develop its innovative GCRAM technology, which is designed to serve as a drop-in replacement for traditional SRAM in system-on-chip (SoC) designs. This technology aims to overcome the limitations of the SRAM-DRAM tradeoff, potentially transforming memory architecture in embedded systems.
The article provides a preliminary analysis of the Apple A16 chip's die, focusing on its architecture and manufacturing process. Insights into its design choices and performance metrics are highlighted, showcasing Apple's advancements in semiconductor technology.