Telink Semiconductor showcased its latest SoC chips and immersive technology demonstrations at CES 2026, highlighting innovations in wireless gaming, Edge AI, and Bluetooth technology. The event underscores Telink's commitment to advancing AIoT solutions in the consumer electronics space.
The article discusses vulnerabilities in the AXI protocol used in modern SoCs, which can lead to denial-of-service attacks. It introduces an Intelligent Hardware Monitoring System (IMS) that uses neural networks for real-time detection of these protocol violations with high accuracy.
The article discusses the importance of selecting the right prototyping partner in the semiconductor industry, highlighting S2C's role in advanced FPGA-based SoC prototyping. The author expresses anticipation for an upcoming update from S2C at the DVCon event in March.
Engineers are now leveraging automation algorithms to optimize network-on-chip configurations, moving away from manual placements of components like switches and buffers. This shift enhances the design process for system-on-chip (SoC) interconnects, particularly for AI workloads.
The article discusses the increasing complexity of System-on-Chip (SoC) designs, which demand enhanced prototype capacity and efficiency. S2C aims to address these challenges with a high productivity toolchain for SoC bring-up.
EMASS's new ultra-low-power SoC is designed to enhance intelligence at the sensor edge, focusing on minimizing size, power consumption, and latency. This innovation was highlighted during an exclusive interview at CES, showcasing its potential applications in various tech sectors.
Xovis has introduced its PF-Series sensor, which enhances AI edge computing and 3D vision capabilities. This new sensor is driven by the company's advanced system-on-chip (SoC) technology.
Texas Instruments has introduced a new family of system-on-chips (SoCs) targeted at the automotive sector during CES 2026. These SoCs are designed to enhance the capabilities of automotive AI applications.
Infineon Technologies AG has launched the AIROC ACW741x, a tri-radio SoC family featuring Wi-Fi 7, Bluetooth LE 6.0, and IEEE 802.15.4 Thread with Matter support. This marks the first implementation of 20-MHz Wi-Fi 7 for IoT applications, enhancing connectivity capabilities.
Ambarella's CV7 SoC utilizes the CVflow computer vision architecture to enable 8K image processing and sophisticated AI inference at the edge. This advancement positions the CV7 as a significant player in the growing demand for high-resolution AI applications.
NXP has launched the S32N7 super-integration processor series designed for centralized vehicle computing across various domains. This innovation aims to enhance vehicle intelligence by consolidating processing capabilities.
Infineon has introduced the AIROC ACW741x family of tri-radio SoCs, which includes the first 20-MHz Wi-Fi 7 device tailored for IoT applications. This innovation is set to enhance connectivity options for smart IoT devices.
The article discusses how System-on-Chip (SoC) designers can utilize certified cryptographic intellectual property (IP) to enhance security and scalability in their solutions. It emphasizes the importance of adhering to FIPS 140-3 standards for cryptographic modules.
AMD has launched its new Ryzen AI Embedded P100 and X100 Series processors, which integrate high-performance CPU, GPU, and NPU technologies for efficient AI processing. These processors are designed to enhance immersive experiences in automotive, industrial automation, and autonomous systems.
Ambiq Micro has introduced Atomiq, the first ultra-low power system-on-chip (SoC) featuring a Neural Processing Unit (NPU) for real-time edge AI applications. This innovation is based on their Subthreshold Power Optimized Technology (SPOT) platform.
Ambarella has introduced a new System on Chip (SoC) at CES that features multi-sensor perception and multi-stream video capabilities while maintaining very low power consumption. This innovation is expected to enhance edge AI applications, particularly in high-resolution 8K video processing.
Ambarella has unveiled its CV7 edge AI vision system-on-chip (SoC) at CES 2026, designed for various AI perception applications. The SoC targets advanced consumer products, enterprise security, robotics, and industrial automation.
Ambarella has launched the CV7 edge AI vision SoC, designed for various AI perception applications, including 8K consumer products and enterprise security cameras. This new chip showcases advanced capabilities in multi-sensor perception, catering to markets such as robotics and industrial applications.
NXP has unveiled a new real-time, super-integration processor aimed at enhancing its automotive processing platform. This announcement marks a significant advancement in technology for smart vehicles.
Texas Instruments (TI) has launched a new family of high-performance computing SoCs designed for autonomous vehicles, featuring a proprietary NPU and chiplet-ready design. Additionally, TI's eight-by-eight 4D imaging radar transceiver and 10BASE-T1S Ethernet PHY will help automakers enhance radar designs and extend Ethernet capabilities at the vehicle edge.