SMIC

Kirin 9030 Hints at SMIC’s Possible Paths Toward >300 MTr/mm2 Without EUV

The teardown of the Kirin 9030 chip reveals that SMIC's 'N+3' process has a lower transistor density compared to Samsung and TSMC's 5nm processes, despite aggressive scaling of metal pitch. This indicates potential challenges for SMIC in achieving competitive performance at advanced nodes.