Samsung plans to increase its DRAM production by only 5% to 4 million wafers this year, according to reports from DigiTimes. This modest growth contrasts with broader expectations for the DRAM industry to expand production significantly.
Samsung has successfully completed the first commercial call using its virtualized RAN (vRAN) technology on a live network operated by a Tier 1 U.S. operator. This achievement marks a significant milestone in the deployment of advanced network technologies.
Smartphone shipments in 2025 increased by 2% year-over-year, reaching approximately 1.25 billion units, according to Counterpoint Research. Apple led the market with a 20% share, followed by Samsung in second place.
Samsung Electro-Mechanics has launched the world's first high-voltage multi-layer ceramic capacitor (MLCC) with a voltage rating increased from 630 V to 1000 V. This innovation is aimed at meeting the demands of CLLC resonant circuits in electric vehicle (EV) systems.
Samsung Electro-Mechanics has introduced the CL32C333JIV1PN# high-voltage MLCC, specifically designed for CLLC resonant converters in xEV applications. This development highlights the growing importance of MLCCs in enhancing the efficiency of electric vehicle technologies.
Foldable smartphone shipments are projected to increase by 30% next year, following a 10% growth in 2025. This growth is driven by anticipated new models, including a foldable iPhone from Apple and Samsung's Galaxy series.
The article discusses the competitive landscape of hybrid bonding technology in semiconductor packaging, highlighting the advantages of direct Cu-Cu and oxide-to-oxide connections. It also mentions Samsung's strategic move to secure a source for glass interposers, which are crucial for advanced packaging solutions.
The article highlights the most viewed stories on Electronics Weekly, including Nvidia's investment in Synopsys, Marvell's acquisition of a photonics startup, and Samsung's launch of a tri-fold phone. These developments reflect significant trends in the semiconductor and technology sectors.
Korean semiconductor giants, including Samsung and SK hynix, are transitioning their focus from traditional memory products to AI-driven technologies like High Bandwidth Memory (HBM). This shift is occurring in the context of heightened global competition, U.S. export controls, and supportive government initiatives.
Samsung has introduced its first tri-fold phone, the Galaxy TriFold, priced at $2440 and featuring a ten-inch display when unfolded. This launch marks a significant step in the foldable smartphone market.
The semiconductor memory market is facing a critical decision regarding profitability and ethical considerations. This dilemma highlights the tension between financial gain and responsible business practices.
SK Hynix plans to significantly increase its 1c DRAM production by eight times in 2026. This move indicates a strategic shift in their manufacturing capabilities to meet growing demand.
Samsung Display and China's BOE have reached a settlement regarding OLED patent and trade secret lawsuits, which could ease tensions between the two companies. This resolution may have implications for the broader OLED market and competitive landscape.
The article discusses the advancements in High Bandwidth Memory (HBM), particularly focusing on HBM4 and its associated technologies. It highlights developments such as custom base die, process flow improvements, and the expansion of production capabilities in China.