TDK has introduced a new series of DC link film capacitors optimized for SiC-based inverters, featuring low equivalent series inductance (ESL) of 8 nH and designed for high-frequency operation. This launch highlights TDK's commitment to advancing components that meet the evolving demands of power electronics.
The article discusses the challenges faced by sensor developers in balancing the accuracy of measurements for one phenomenon while addressing customer demands for additional functionalities. It highlights the importance of adapting to user feedback in the development of nanoscale sensors.
CEA-Leti is showcasing advancements in the integration of quantum cascade lasers with silicon photonic platforms at SPIE Photonics West 2026. This research focuses on mid-infrared applications, highlighting significant progress in micro/nanotechnology.
Coherent Corp has introduced bondable diamond solutions designed for thermal management in semiconductor applications. This innovation allows for direct bonding to semiconductor die, significantly enhancing cooling performance by reducing thermal interface resistance.
The article discusses advancements in semiconductor technologies, specifically focusing on atomic layer deposition (ALD) for ruthenium (Ru) wiring, the development of vertical nanolasers, and the exploration of hydrogel semiconductors. These innovations highlight ongoing research efforts aimed at enhancing semiconductor performance and capabilities.
The article highlights recent advancements in semiconductor technology, including low temperature Cu-Cu bonding and innovations in EUV resists. It also discusses developments in quantum hardware and photonic integration, which are crucial for future applications.
A Danish-led ESA project aims to enable the manufacturing of electronics on the Moon to reduce reliance on Earth-based supplies for future lunar missions. This initiative represents a significant step towards sustainable extraterrestrial operations.
GeoCue has partnered with Coptrz to distribute its LiDAR mapping products in the UK, aiming to enhance access to aerial mapping technology for professionals in surveying and engineering. This collaboration signifies a strategic move to broaden the market reach of GeoCue's innovative solutions.
Iceye has expanded access to its satellite-based Synthetic Aperture Radar (SAR) imagery for Ukraine and signed a new agreement with Sweden. This move enhances the availability of critical data for these nations.
Voyant Photonics' CEO discusses the company's ambition to make LiDAR technology as ubiquitous as cameras through the development of solid-state 4D FMCW sensing. This innovation was highlighted during an interview at CES, showcasing the potential for widespread adoption of LiDAR in various applications.
Richard Hegberg, CEO of Caspia Technologies since 2024, shares insights about his extensive background in the semiconductor industry, including leadership roles at several notable companies. The article provides a platform for discussing the future outlook of Caspia Technologies within the semiconductor landscape.
PhotonDelta has launched its second global engineering contest to foster innovation in photonic chip applications. The initiative, in collaboration with SIEMENS and Wevolver, aims to address global challenges through advanced photonic technologies.
ALLOS Semiconductors and Ennostar have formed a strategic partnership to produce 200mm GaN-on-Si LED epiwafers for micro-LED applications. This collaboration aims to establish a silicon fab-compatible supply chain for micro-LED products.
APEC 2026 has announced four distinguished speakers for its Plenary Session, focusing on topics relevant to power electronics engineers. This event is poised to highlight advancements and innovations within the power electronics sector.
TDK showcased its innovative solutions at CES 2026, focusing on enhancing sensing, inference, and context awareness in wearables and smart glasses. This development signifies a potential shift in how edge devices process and interpret data.
The EW BrightSparks initiative celebrates young engineering talent in the UK, highlighting Aurelia Brzezowska from the University of Staffordshire in its 2025 profile. This recognition is part of a broader effort to showcase the next generation of engineers in the electronics field.
Photon Design Ltd is showcasing its latest photonic simulation tools at the SPIE Photonics West 2026 event in San Francisco. The innovations include HAROLD (QD), MT-FIMMPROP, and EPIPPROP, which will also be featured in various academic and commercial presentations at the show.
PhotonDelta has initiated its second global engineering contest aimed at advancing photonic IC applications in collaboration with Wevolver. This initiative seeks to foster innovation and development within the photonic chip industry.
ClearSpace and the European Space Agency have initiated the Prelude mission to advance technologies for in-orbit life extension and active debris removal. This mission aims to enhance safety and sustainability in space operations.
The article introduces InterPUF, a new authentication framework designed for reconfigurable interposers in system-in-package platforms. It addresses trust challenges in decentralized environments by embedding a physically unclonable function and utilizing multi-party computation for secure authentication.