The article discusses the 'Big Allis' generator manufactured by Allis-Chalmers, which experienced a significant design flaw during the 1965 Northeastern blackout. This historical event highlights the importance of design integrity in large-scale power generation systems.
X-FAB's XbloX platform offers a standardized and flexible set of silicon carbide (SiC) process technologies that streamline the development of advanced power devices. This platform enables faster production timelines, with the potential to start production up to nine months earlier than traditional methods.
Ambient computing enhances the Internet of Things (IoT) by enabling real-time responses to monitored parameters through a smart network. This integration allows for efficient tracking of data such as movement and temperature with minimal human intervention.
X-FAB is launching its XbloX platform to provide standardized yet flexible access to advanced silicon carbide (SiC) process technologies. This initiative aims to expedite the development of advanced power devices through rapid prototyping.
onsemi has launched its 650V and 950V EliteSiC MOSFETs in the T2PAK top-cool package, which are now being shipped to lead customers. This product aims to provide improved thermal performance, reliability, and design flexibility for demanding applications.
ROHM has initiated mass production of its SCT40xxDLL series of SiC MOSFETs utilizing TOLL packages, which promise improved performance over traditional TO-263-7L packages. This advancement marks a significant step in the development of more efficient semiconductor components.
Navitas is introducing high-voltage SiC MOSFETs with voltage ratings of 2.3-kV and 3.3-kV in various formats including power-module and discrete. This development aims to enhance performance in critical energy systems.
TDK Electronics has introduced S series NTC thermistors that can handle steady-state currents up to 35 A and absorb energy up to 750 J. These components are designed to suppress inrush currents, enhancing the reliability of electronic systems.
Murata has commenced mass production of 1.25-kV multilayer ceramic capacitors (MLCCs) featuring a capacitance of 15 nF in a compact 1210-size package. This development aims to enhance stability in various electronic applications.
Taiyo Yuden has introduced the HVX(-J) and HTX(-J) series of conductive polymer hybrid aluminum electrolytic capacitors. These new capacitors are designed to handle increased ripple current, enhancing their performance in various applications.
Coherent Corp has developed a next-generation 300mm silicon carbide platform, building on its 200mm expertise to address the increasing thermal loads in modern data centers. This transition to larger-diameter SiC wafers is expected to enhance energy efficiency and thermal performance significantly.
ROHM has initiated mass production of its SCT40xxDLL series of SiC MOSFETs in TOLL packages, which provide significantly improved thermal performance compared to traditional packages. This advancement is particularly beneficial for high-power applications in compact designs, such as server power supplies and energy storage systems.
Infineon Technologies is set to provide customized silicon carbide (SiC) power modules to Electreon, which specializes in wireless charging solutions for electric vehicles. This partnership aims to enhance Electreon’s dynamic in-road charging technology for EVs.
Navitas Semiconductor has announced the availability of its new 3300V and 2300V ultra-high voltage silicon carbide products in various formats. These products are designed to enhance reliability and performance in critical energy infrastructure applications.
Littelfuse has launched a new high-current X4-Class Power MOSFET that enhances thermal management and efficiency while minimizing component count in various applications. This innovation is particularly relevant for energy, charging, drone, and industrial systems.
DG Matrix has introduced the first commercially available multiport solid-state transformer (SST) utilizing silicon carbide (SiC) technology, which is supported by multiple patents. This innovation marks a significant advancement in power electronics and energy management solutions.
The article discusses the rising importance of power delivery in semiconductor design, particularly in the context of AI applications. It highlights new power-delivery chiplets that could potentially reduce AI power consumption by 50%.
The article discusses the importance of efficiently controlling magnetization in advancing spintronic technologies, which leverage electron spin for enhanced electronic device performance. It highlights the potential of magnons in achieving this control, paving the way for faster and more energy-efficient devices.
The paper introduces extit{throttLL'eM}, a framework designed to optimize energy consumption during Large Language Model (LLM) inference by adjusting GPU frequency and instance sizes. It utilizes machine learning to predict future resource usage, ensuring compliance with Service-Level Objectives (SLOs) while minimizing energy costs.
The article discusses a novel in-situ encryption method for single-transistor nonvolatile memories (NVMs) that eliminates the need for multiple memory devices per encrypted cell. This approach utilizes ferroelectric FET (FeFET) technology to maintain storage density while enhancing data security.