Coherent Corp has introduced bondable diamond solutions designed for thermal management in semiconductor applications. This innovation allows for direct bonding to semiconductor die, significantly enhancing cooling performance by reducing thermal interface resistance.
The article discusses advancements in semiconductor technologies, specifically focusing on atomic layer deposition (ALD) for ruthenium (Ru) wiring, the development of vertical nanolasers, and the exploration of hydrogel semiconductors. These innovations highlight ongoing research efforts aimed at enhancing semiconductor performance and capabilities.
The article discusses the evolving role of GPUs in AI computation as the technology expands beyond traditional data centers. It highlights the increasing relevance of FPGAs in the AI data path due to system constraints.
Ligentec and X-Fab are collaborating to market X-Fab's XPH90 Silicon Photonics technology, integrating it into Ligentec's photonics platform. This partnership aims to create a unified ecosystem that enhances the capabilities of silicon photonics applications.
Microchip Technology has enhanced its PolarFire FPGA ecosystem by introducing new SDI IP cores and a Quad CoaXPress Bridge Kit, aimed at developers requiring efficient video connectivity solutions. This expansion includes various tools and resources designed to facilitate development and improve security.
The article discusses the advantages of Siemens Veloce proFPGA CS for FPGA-based prototyping projects. It highlights how users can leverage this solution to enhance performance in their designs.
The Quectel SP895BD-AP smart module, powered by Qualcomm, targets high-performance IoT applications with ultra-high-definition displays, particularly in video conferencing and interactive gaming. This module also supports edge computing and robotics, indicating a broad range of potential uses in advanced technology sectors.
The article discusses the critical need for predictive maintenance in modern manufacturing to avoid costly downtime. It highlights the unsustainability of traditional reactive maintenance methods in light of the significant financial impacts of unexpected failures.
TIRIAS Research analysts discuss the recent CES announcements from AMD and Nvidia, focusing on their implications for AI and the broader tech landscape in 2026. The analysis highlights the competitive dynamics between these two semiconductor giants in the context of physical AI advancements.
The article discusses the challenges AI training faces, particularly in transferring large datasets between memory and processors. This issue highlights the increasing demand for efficient memory solutions in AI applications.
The article introduces SwiftKV Attention, an efficient algorithm designed for low-latency attention inference on edge accelerators, which processes each token in a single pass without resource-intensive operations. It also presents the SwiftKV-MHA accelerator, capable of high precision attention and low precision GEMV, facilitating fast multi-head parallel decoding.
The article introduces RidgeWalker, a high-performance accelerator for Graph Random Walks (GRWs) on datacenter FPGAs, addressing challenges like data dependencies and irregular memory access. It highlights a novel asynchronous pipeline architecture that enables perfect pipelining and adaptive load balancing through a feedback-driven scheduler.
The paper introduces Value Level Parallelism (VLP) as a method to enhance the efficiency of large language models (LLMs) by improving general matrix multiply operations. It also presents a new architecture, Mugi, which incorporates these innovations to optimize LLM performance and accuracy.
The article focuses on deriving design equations for a second-order Phase-Locked Loop (PLL) that incorporates a lag-lead filter by analyzing its Bode plots. This approach aims to enhance the understanding of PLL performance in various applications.
Researchers at National Yang Ming Chiao Tung University have published a paper on enhancing the thermal stability of low temperature Cu-Cu bonding using a thin Ag passivation layer. This advancement targets applications in advanced electronic packaging.
NASA has demolished two historic test stands at the Marshall Space Flight Center, marking the end of an era in U.S. space exploration. These structures were instrumental in the development of technologies that contributed to human spaceflight, including the Apollo missions.
Sam Geha from Infineon Technologies highlights the PSOC Edge, a cutting-edge MCU solution aimed at enhancing AI and IoT capabilities at CES 2026. This innovation promises to address the growing demand for secure and high-performance IoT applications.
The article features a weekly roundup of robotics videos, highlighting advancements in robotics technology. It also promotes the upcoming ICRA 2026 event in Vienna, encouraging community engagement.
Photonic Integrated Circuits (PICs) are transforming data centers and security systems by overcoming traditional electronic limitations. This advancement is crucial for the development of quantum infrastructure.
The article argues that the era of traditional software development, akin to PDFs, is being replaced by more flexible and efficient methods, represented by markdown. It suggests that memory hierarchies serve as a better analogy for the evolution of software, indicating a shift in value creation within the industry.