onsemi has launched its 650V and 950V EliteSiC MOSFETs in the T2PAK top-cool package, which are now being shipped to lead customers. This product aims to provide improved thermal performance, reliability, and design flexibility for demanding applications.
ROHM has initiated mass production of its SCT40xxDLL series of SiC MOSFETs utilizing TOLL packages, which promise improved performance over traditional TO-263-7L packages. This advancement marks a significant step in the development of more efficient semiconductor components.
OKW has introduced CONNECT fast-assembly handheld plastic enclosures that come with optional integrated cable glands. This innovation simplifies the installation process for power and data connections in handheld devices.
ROHM has initiated mass production of its SCT40xxDLL series of SiC MOSFETs in TOLL packages, which provide significantly improved thermal performance compared to traditional packages. This advancement is particularly beneficial for high-power applications in compact designs, such as server power supplies and energy storage systems.
Vishay Intertechnology has introduced two new 1200V MOSFET power modules aimed at enhancing efficiency and reliability in various applications. These modules feature a low-profile MAACPAK PressFit package and utilize advanced silicon carbide technology.
Ironwood Electronics has introduced a manual-actuated test socket for QFN24 devices that enables solderless evaluations. This socket features a double-latch mechanism for controlled compression, facilitating quick device changeovers in testing environments.
The article discusses how the performance of AI systems is increasingly reliant on optical technologies, including co-packaged optics (CPO) and dense wavelength division multiplexing (DWDM). These advancements are crucial for reducing energy consumption and latency while enhancing bandwidth in AI factories.
The blog post discusses various advanced semiconductor technologies, including 2.5D and 3D-IC packaging, physical AI applications, and the integration of Manufacturing Execution Systems (MES) with Advanced Process Control (APC). It also touches on innovations like phased array antennas and Scalable Matrix Extension.
November was a vibrant month for the semiconductor industry, marked by innovative technology showcases and leadership achievements. Companies focused on advanced packaging, AI-enhanced design platforms, and strategic partnerships to drive growth and inclusivity in the workforce.
Same Sky’s Audio Group has launched a new line of receivers designed for over-the-ear speaker applications, featuring sound pressure levels between 103 to 135 dB. The CMR family of receivers also boasts compact package sizes starting at 12 x 6 mm.
The article discusses the growing interest in glass interposer substrates and hybrid bonding techniques in semiconductor packaging. It highlights a recent publication that explores these technologies in detail, authored by industry experts.
The embedded industry is evolving towards compact, intelligent, and connected solutions, driving the demand for advanced packaging that balances miniaturization and performance. Modern devices are increasingly required to handle complex tasks, including wireless connectivity.
Dr. Huaguang Wang from Indium Corporation will present on enhancing the reliability of large BGA assemblies for AI servers and high-performance computing at EPTC 2025 in Singapore. His insights are expected to address critical challenges in the reliability of semiconductor packaging for these advanced applications.
Co-packaged optics is gaining attention in advanced packaging due to its potential to enhance bandwidth density, reduce power consumption, and lower latency. These improvements are crucial for the advancement of AI technologies.
The article discusses how advancements in packaging technologies can enhance the interconnection resources for chiplets, facilitating the development of larger and more energy-efficient VLSI systems. It highlights the potential to simplify ESD protection and signaling, which could lead to smaller chiplet sizes.
Researchers from Arizona State University and the University of Minnesota have published a paper discussing advancements in ESD protection and signal integrity for 2.5D/3D packaging technologies. The paper highlights how scaling these advanced packaging technologies can enhance interconnection resources for heterogeneous integration in VLSI systems.
Brewer Science will co-present technical papers with imec at EPTC 2025, focusing on advancements in thin interposer assembly and flash-lamp debonding. These contributions aim to enhance reliable die-to-wafer integration, building on previous developments in hybrid bonding and laser debonding.
The article discusses 3D-IC technology, which integrates logic, memory, and accelerators in close physical proximity. This approach aims to enhance performance and efficiency in semiconductor design.
The article reflects on the author's retirement after two decades in the semiconductor industry, particularly focusing on advanced packaging. It highlights the significance of SEMICON Europa 2007 in shaping the author's career and passion for 3D integration and packaging.
Koh Young Technology will showcase its advanced semiconductor inspection solutions at SEMICON Japan 2025, emphasizing production-speed and high-precision capabilities. The event will take place from December 17 to 19 at Tokyo Big Sight.