The article highlights recent advancements in semiconductor technology, including low temperature Cu-Cu bonding and innovations in EUV resists. It also discusses developments in quantum hardware and photonic integration, which are crucial for future applications.
SK Hynix is making a significant investment of $13 billion in a new HBM packaging plant, positioning itself as a leader in the AI memory market. This move is indicative of the company's strategy to redefine its role in the memory sector.
Researchers at National Yang Ming Chiao Tung University have published a paper on enhancing the thermal stability of low temperature Cu-Cu bonding using a thin Ag passivation layer. This advancement targets applications in advanced electronic packaging.
Microchip has introduced JANPTX transient voltage suppressors (TVS) that are among the first to meet MIL-PRF-19500 qualification in a plastic package. This advancement highlights the growing capabilities of plastic packaging in meeting stringent military standards.
The article discusses the potential of stacking high-bandwidth memory (HBM) directly on top of GPUs to enhance performance by reducing the energy and delay associated with data transfer. This innovation could significantly alleviate the bottleneck currently faced in AI computing.
The article discusses the challenges faced by wafer probe technology in adapting to multi-die assemblies due to delicate features and uneven surfaces. These factors complicate the management of probe force and reliability in testing.
The article discusses a new lithography strategy that integrates a large exposure field with high-resolution imaging and algorithmic early zone correction. This approach aims to minimize alignment errors in the fabrication process of next-generation fan-out panel-level packaging (FOPLP).
The article discusses how advanced surface metrology techniques, specifically Atomic Force Microscopy (AFM) and Advanced Fabrication Processes (AFP), can improve the integrity of hybrid bonding in semiconductor packaging. These enhancements are expected to lead to better device performance.
The adoption of hybrid bonding in HBM4 has been delayed due to process cost and yield issues, leading to a continued reliance on microbumps. This decision reflects ongoing challenges in advancing packaging technologies within the semiconductor industry.
The article provides insights into recent advancements in Gallium Nitride (GaN) technology for multilevel buck converters, wide bandgap (WBG) thermal packaging, and near-field communication (NFE). It highlights key developments in power electronics that are shaping the industry.
Marktech Optoelectronics and Optrans Corp are set to launch new transfer-molded photodiode and LED packaging capabilities, with availability expected in Q2 2026. These next-generation packages promise enhanced reliability and performance for both conventional and advanced LED technologies.
Ironwood Electronics has introduced a 0.8 mm pitch BGA socket adapter designed for prototyping, testing, and programming chip-scale BGA devices with ultra-fine footprints. This adapter accommodates a 19 × 19 mm body with a 22 × 22 array 484-ball BGA package, offering flexibility in usage with top adapters.
The article provides an overview of key semiconductor trends including Through-Silicon Vias (TSVs), thermal management, AI-assisted design methodologies, and the evolution of 6G technology. It also discusses model trade-offs that are becoming increasingly relevant in the industry.
Researchers at the University of Ottawa have published a paper on optimizing 2.5D flip-chip packages using silicon and glass interposers. The study introduces a simulation-driven framework that integrates finite element analysis and machine learning to address thermo-mechanical challenges.
The article discusses advancements in thermal packaging for wide-bandgap power semiconductor devices, specifically silicon carbide (SiC) and gallium nitride (GaN). These advancements are crucial for enhancing power conversion efficiencies and improving power density in semiconductor applications.
Cortec has enhanced the strength and tack of its Eco Wrap, an industrially compostable wrapping film. This product was initially introduced five years ago and is produced with certified materials.
Co-Packaged Optics (CPO) technology is finally reaching the market with deployment-ready products emerging in 2025. This development is set to significantly enhance datacenter connectivity.
Socionext has achieved two successful tape-outs of complex 3D-IC designs in just seven months, targeting AI and HPC applications. This rapid iteration showcases advancements in packaging, EDA tools, and collaboration within the foundry ecosystem.
The article discusses the current status of co-packaged optics (CPO) technology as of 2025 and outlines future prospects for 2026 and beyond. It emphasizes the importance of CPO in the realm of optical interconnect technology.
The article discusses the complex logistics involved in semiconductor production, highlighting the challenges of offshore packaging processes that contribute to increased costs and delays. It emphasizes the risks associated with multiple hand-offs in the supply chain for semiconductor materials and components.