Toshiba has successfully integrated its SmartMCD technology for dual brushed DC motors into Mikroe’s SmartMCD TB9M001FTG automotive board. This development allows automotive system engineers to enhance their designs with advanced motor control capabilities.
QD Laser Inc. has placed an order for an MBE 6000 production system from Riber S.A. to enhance its quantum dot laser manufacturing capabilities. This move aims to support the growing demand for advanced optoelectronic devices in the datacom sector.
Mitsubishi Electric is set to ship samples of four new trench SiC MOSFET bare dies designed for power electronics, particularly in electric vehicles and renewable energy systems. These advancements aim to enhance power efficiency while maintaining performance in various applications.
Toshiba is enhancing its CUZ series of surge protection Zener diodes by introducing four new products with varying Zener voltages. This expansion aims to meet growing demands for surge protection solutions in various applications.
Synspective has secured a contract to provide a satellite constellation for Japan's Ministry of Defense, focusing on synthetic aperture radar technology. This partnership highlights the growing intersection of defense and advanced technology sectors in Japan.
Sumitomo Chemical Co Ltd is set to showcase its compound semiconductor products at the SPIE Photonics West 2026 event in San Francisco. The exhibition will take place from January 20 to 22, highlighting the company's focus on this specialized segment of the semiconductor market.
EdgeCortix® Inc. has announced that its SAKURA-II AI co-processor has passed NASA's heavy ion testing, confirming its radiation resiliency for use in orbital and lunar missions. This validation marks a significant milestone for the company in the aerospace sector.
Mitsubishi Electric is introducing higher-current silicon carbide (SiC) devices designed to enhance locomotive power converters. This innovation is expected to significantly impact the efficiency and performance of locomotive systems.
Nissan's new vehicle sales in Japan have dropped to a 32-year low, with a market share of only 9% reported by the Japan Automobile Dealers Association. This decline highlights significant challenges for the automaker in a competitive market.
Researchers in Japan have developed ultrathin ferroelectric capacitors that maintain strong polarization at a stack thickness of just 30 nm. This advancement could lead to significant improvements in ferroelectric memory technology.
NTT is set to implement AI-native architectures to automate the majority of its IT systems development. This shift has been highlighted by Gartner as a pivotal technology in the current landscape.
Japan's Ministry of Economy, Trade and Industry (METI) has announced a 50% increase in its budget for FY 2026, raising it to $20 billion. The funding is primarily aimed at supporting the development of integrated circuits (ICs) and artificial intelligence (AI) technologies.
Fujitsu is collaborating with Softbank and Intel on the Saimemory project, which aims to develop an alternative to High Bandwidth Memory (HBM). The initiative is backed by a $52 million investment and seeks to bring a product to mass production.
Fuji Electric and Robert Bosch are collaborating to develop silicon carbide (SiC) power semiconductor modules specifically for electric vehicles (EVs). This partnership aims to enhance package compatibility in their offerings.
Renesas Electronics is enhancing its software-defined vehicle (SDV) solutions with the introduction of the R-Car Gen 5 family, specifically the R-Car X5H, which is the first multi-domain automotive SoC built on a 3nm process. This advancement positions Renesas as a key player in the rapidly evolving automotive semiconductor market.
Rapidus has introduced a suite of AI design tools as part of its Rapidus AI-Assisted Design Solution (Raads). This initiative aims to enhance its Rapid and Unified Manufacturing Service.
Imec and Japan’s ASRA have announced a strategic initiative to standardize chiplet architectures specifically for automotive applications. This alignment aims to enhance interoperability and efficiency in the automotive semiconductor sector.
Toshiba is set to enhance its semiconductor design capabilities by adopting Siemens' electronic design automation (EDA) software. This move aims to accelerate the design process, improve power integrity, and increase the reliability of Toshiba's next-generation analog ICs and power devices.
A team from Hokkaido University and TDK Corp. has developed an AI chip that can predict and counter a player's moves in rock-paper-scissors using motion detection. This chip learns individual gestures to enhance its predictive capabilities in real-time gameplay.
NTT, Inc. has successfully demonstrated the amplification of high-frequency wireless signals using aluminum nitride (AlN) transistors. This marks a significant advancement in the development of ultra-wide bandgap device structures.