Japan

ROHM has initiated mass production of its SCT40xxDLL series of SiC MOSFETs in TOLL packages, which provide significantly improved thermal performance compared to traditional packages. This advancement is particularly beneficial for high-power applications in compact designs, such as server power supplies and energy storage systems.

EE Times

Vicinity Technologies and NXP Demonstrate Breakthrough Industrial 5G Performance at 5G-ACIA “Industrial 5G Day 2025” in Tokyo

Dec 04, 2025

Vicinity Technologies and NXP Semiconductors have demonstrated significant advancements in industrial 5G performance at the 5G-ACIA event in Tokyo. This showcases the growing integration of advanced communication technologies in industrial applications.

Semiconductor Today

Nuvoton launches compact 1.7W 402nm violet laser in TO-56 CAN package

Dec 03, 2025

Nuvoton Technology Corp has introduced the KLC435FS01WW, a compact high-power violet laser diode with an output power of 1.7W at a wavelength of 402nm, packaged in a TO-56 CAN format. This product is positioned as having industry-leading optical output power.

EE Journal

Fujitsu achieves high-precision, long-duration molecular dynamics simulation for all-solid-state battery interphases with over 100,000 atoms

Dec 01, 2025

Fujitsu has developed a technology for molecular dynamics simulation that allows for atomic-level analysis of the solid electrolyte interphase formation in all-solid-state batteries. This breakthrough enables a better understanding of battery performance, which has been challenging to analyze previously.

All About Circuits

Toshiba Adds Zener Diode Series for Better Circuit Reliability

Nov 27, 2025

Toshiba has introduced the CMXBxxA Zener diode series, which aims to enhance circuit reliability by reducing leakage. This new lineup also facilitates easier upgrades for power line protection systems.

Electronics Weekly

8 x 8mm 600V 47mΩ super junction mosfet

Nov 27, 2025

Toshiba has introduced a new 47mΩ 600V n-channel super-junction MOSFET, the TK057V60Z, packaged in an 8 x 8mm DFN format. This device is capable of handling continuous currents of 40A with adequate heatsinking.

Tom's Hardware

Rapidus to start construction on 1.4nm fab in 2027 — research and development on node to begin next year

Nov 25, 2025

Rapidus, a Japanese startup, has announced plans to construct a 1.4-nm semiconductor fabrication facility in Hokkaido, with construction set to begin in 2027. Research and development on this advanced process node will commence next year.

3D InCites

Koh Young Highlights 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight

Nov 24, 2025

Koh Young Technology will showcase its advanced semiconductor inspection solutions at SEMICON Japan 2025, emphasizing production-speed and high-precision capabilities. The event will take place from December 17 to 19 at Tokyo Big Sight.

Tom's Hardware

Large-capacity microSD cards are now regularly out of stock in Japan as storage crunch claims another victim — high-capacity HDDs are also vanishing

Nov 23, 2025

Large-capacity microSD cards are experiencing significant demand in Japan due to a memory shortage that is also affecting high-capacity hard drives. Consumers are increasingly purchasing microSD cards ranging from 512 GB to 2 TB, driven by the advancements in the microSD Express standard.

Tom's Hardware

A tiny 0.5MB SmartMedia card wins the Small Capacity Memory Card Championship (Japan) — 2KB Casio battery-backed RAM card lost due to a technicality

Nov 22, 2025

The Small Capacity Memory Card Championship in Japan concluded with a 0.5MB SmartMedia card winning, while a 2KB Casio battery-backed RAM card was disqualified due to a technicality. This event highlights the competitive landscape of small-capacity memory solutions.

EE Journal

ROHM’s Three-Phase Brushless DC Motor Gate Driver Minimizes FET Heat Generation and EMI

Nov 19, 2025

ROHM Semiconductor has introduced the BD67871MWV-Z, a three-phase brushless DC motor gate driver designed for medium voltage applications. This new driver utilizes TriC3™ technology to reduce FET switching loss and minimize electromagnetic interference (EMI).

All About Circuits

Toshiba’s Hard Disk Drive Targets the Storage Crunch in AI Surveillance

Nov 17, 2025

Toshiba has introduced a new hard disk drive specifically designed for AI-driven video surveillance systems. This addition aims to address the growing storage demands associated with large-scale AI applications.

IEEE Spectrum Semiconductors

The First Ticket Pre-Purchasing System Was Created 65 Years Ago

Nov 17, 2025

The article discusses the evolution of ticket purchasing systems in Japan, highlighting the challenges faced by commuters 65 years ago. It emphasizes the transformation brought about by the Japanese National Railways in 1960, which streamlined the reservation process.

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Semiconductor Today

imec achieves record GaN breakdown exceeding 650V on Shin-Etsu Chemical’s 300mm QST substrate

Nov 17, 2025

Shin-Etsu Chemical's QST substrate has been successfully utilized in imec's development of 300mm gallium nitride (GaN) power devices, achieving a record breakdown voltage exceeding 650V. This marks a significant advancement in the performance capabilities of GaN technology for power devices.

IEEE Spectrum Semiconductors

How Do You Know Whether You Perceive Pain the Same as Others?

Nov 12, 2025

A new platform developed by NTT Docomo aims to objectively measure and compare individual perceptions of pain by analyzing brain activity. This technology seeks to enhance the understanding of pain experiences between individuals.

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Hot Topics

ROHM launches 13–65mΩ SiC MOSFETs in TOLL package

Vicinity Technologies and NXP Demonstrate Breakthrough Industrial 5G Performance at 5G-ACIA “Industrial 5G Day 2025” in Tokyo

Nuvoton launches compact 1.7W 402nm violet laser in TO-56 CAN package

Fujitsu achieves high-precision, long-duration molecular dynamics simulation for all-solid-state battery interphases with over 100,000 atoms

Toshiba Adds Zener Diode Series for Better Circuit Reliability

8 x 8mm 600V 47mΩ super junction mosfet

Rapidus to start construction on 1.4nm fab in 2027 — research and development on node to begin next year

Koh Young Highlights 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight

Large-capacity microSD cards are now regularly out of stock in Japan as storage crunch claims another victim — high-capacity HDDs are also vanishing

A tiny 0.5MB SmartMedia card wins the Small Capacity Memory Card Championship (Japan) — 2KB Casio battery-backed RAM card lost due to a technicality

ROHM’s Three-Phase Brushless DC Motor Gate Driver Minimizes FET Heat Generation and EMI

Toshiba’s Hard Disk Drive Targets the Storage Crunch in AI Surveillance

The First Ticket Pre-Purchasing System Was Created 65 Years Ago

imec achieves record GaN breakdown exceeding 650V on Shin-Etsu Chemical’s 300mm QST substrate

How Do You Know Whether You Perceive Pain the Same as Others?