Curtiss-Wright and Green Hills Software have developed a COTS processing module utilizing the 13th Gen Intel Core i7 processor, aimed at enhancing safety-critical avionics systems. This module, named the V3-1222, is designed to make safety-certifiable computing more accessible.
Abaco Systems has launched the SBC3518, a rugged 3U VPX Single Board Computer powered by Intel's Core Ultra Series 3 processors, aimed at high-performance applications in commercial, defense, and aerospace sectors. This product emphasizes the importance of speed, reliability, and advanced AI capabilities at the tactical edge.
Intel's product marketing at CES has shown improvement in understanding market realities, although their AI marketing efforts fell short again. The PTL 18A process technology has been positively highlighted.
Ignite Next aims to accelerate the commercialization of European deep-tech startups. The initiative is supported by major industry players Intel, Infineon, and Synopsys.
ADLINK has launched its first COM Express module featuring Intel's Core Ultra 9 processors, designed for high graphics performance and efficient system integration. The module supports advanced hybrid CPU architecture and is optimized for demanding edge AI workloads.
ASRock Industrial has launched the NUC(S) Ultra 300 BOX Series, featuring Intel® Core™ Ultra processors designed to enhance AI performance. This new series aims to deliver significant AI inferencing power, reaching up to 180 TOPS.
Major semiconductor companies like Intel, Nvidia, and AMD showcased their latest processors at CES, indicating a competitive push in AI technology. These advancements are expected to significantly influence AI PCs, data centers, and embedded AI applications.
SECO has launched the SOM-COMe-BT6-PTL, a new COM Express Type 6 module that utilizes the recently unveiled Intel Core Ultra Series 3 processors. This module aims to enhance embedded and industrial applications with advanced hybrid compute and AI capabilities.
Fujitsu is collaborating with Softbank and Intel on the Saimemory project, which aims to develop an alternative to High Bandwidth Memory (HBM). The initiative is backed by a $52 million investment and seeks to bring a product to mass production.
Nvidia has decided not to proceed with Intel's 18A manufacturing process due to concerns over yield and performance. This decision follows Nvidia's $5 billion investment in Intel earlier in September.
A new technical paper discusses the use of multimodal atomic force microscopy to investigate the early stages of plasticity in electroplated copper, which is crucial for hybrid bonding applications. This research is a collaboration between the National Institute of Standards and Technology, Intel, and Colorado School of Mines.
Intel and Amkor are collaborating to enhance high volume manufacturing of Embedded Multi-Die Interconnect Bridge (EMIB) technology, driven by demand from the AI industry. This partnership will establish EMIB assembly processes in multiple global locations, including Korea, Portugal, and Arizona.
Advantech has launched a new industrial PC family called IPC-221, featuring a compact design with all connectors on one side. The dimensions of the device are 240 x 233 x 93mm, making it suitable for various industrial applications.
Aurora is Argonne National Laboratory's first Exascale supercomputer, utilizing advanced technologies such as Intel's Xeon Data Center GPUs and High Bandwidth Memory. The system aims to enhance scientific discovery through innovative architecture and a robust software ecosystem.
The article discusses the prevalence of toxic work environments in the engineering field, particularly among semiconductor professionals. It highlights the negative impact of toxic managers and teammates on career development and workplace morale.
The article discusses the increasing demand for low-latency 4K UHD video encoding, highlighting the integration of dedicated hardware encoders in modern GPUs. It evaluates the performance of low-latency encoding modes on GPUs from NVIDIA, Intel, and AMD, comparing them to normal-latency settings.
Mouser Electronics has announced the winners of the 2025 Create the Future Design Contest, a global initiative aimed at fostering innovation among engineers. This contest has been sponsored by Mouser for over a decade, highlighting its commitment to supporting new ideas in technology.
TSMC has initiated legal proceedings against former Senior Vice President Wei-Jen Lo for allegedly transferring trade secrets to Intel. This situation highlights a complex rivalry between TSMC's leadership and Intel's strategic maneuvers.
Darveen is enhancing its DPC-9000 Series by integrating the Intel® Alder Lake-N N97 platform, which is already popular in HMI and industrial control applications. The upgraded models promise improved performance and efficiency while offering a variety of size options.
TSMC has filed a lawsuit against former executive Wei-Jen Lo for allegedly violating non-disclosure and non-compete agreements after he joined Intel. The chipmaker claims it is highly likely that he stole trade secrets during his transition.