Coherent Corp has introduced bondable diamond solutions designed for thermal management in semiconductor applications. This innovation allows for direct bonding to semiconductor die, significantly enhancing cooling performance by reducing thermal interface resistance.
The article discusses the evolving role of GPUs in AI computation as the technology expands beyond traditional data centers. It highlights the increasing relevance of FPGAs in the AI data path due to system constraints.
Ligentec and X-Fab are collaborating to market X-Fab's XPH90 Silicon Photonics technology, integrating it into Ligentec's photonics platform. This partnership aims to create a unified ecosystem that enhances the capabilities of silicon photonics applications.
SK Hynix is making a significant investment of $13 billion in a new HBM packaging plant, positioning itself as a leader in the AI memory market. This move is indicative of the company's strategy to redefine its role in the memory sector.
QD Laser Inc. has placed an order for an MBE 6000 production system from Riber S.A. to enhance its quantum dot laser manufacturing capabilities. This move aims to support the growing demand for advanced optoelectronic devices in the datacom sector.
Allegro has launched the ACS37200, an ultra-low-loss isolated current sensor that significantly reduces power loss and space requirements in various applications. This innovation is particularly beneficial for electric vehicles, industrial systems, and data centers.
The article discusses the current state of the diamond semiconductor industry and features an interview with Adam Khan from Diamond Quanta, focusing on their diamond-on-silicon technology. This technology aims to make diamond semiconductors more accessible and comparable to silicon.
The article introduces RidgeWalker, a high-performance accelerator for Graph Random Walks (GRWs) on datacenter FPGAs, addressing challenges like data dependencies and irregular memory access. It highlights a novel asynchronous pipeline architecture that enables perfect pipelining and adaptive load balancing through a feedback-driven scheduler.
Ed highlights the pressing challenge of generating sufficient electricity to support the growing number of datacenters. This concern reflects broader issues within the electronics industry regarding energy supply and infrastructure.
The article discusses the emergence of a data center boom in the UK driven by advancements in artificial intelligence. This growth is expected to significantly impact the technology landscape in the region.
Moshe Tanach, co-founder and CEO of NeuReality, discusses his background and leadership in engineering roles at major semiconductor companies. His experience spans complex wireless and networking products, highlighting his expertise in the industry.
The demand for power in U.S. AI data centers is projected to reach 106 gigawatts by 2035, marking a significant increase from earlier forecasts. However, the growth is threatened by shortages of engineers and skilled labor necessary for construction and operation.
Photonic Integrated Circuits (PICs) are transforming data centers and security systems by overcoming traditional electronic limitations. This advancement is crucial for the development of quantum infrastructure.
Powell Electronics has added Samtec's new AcceleRate mP series connectors, which feature a 0.635 mm pitch and are designed for high-density, high-speed applications. These connectors include rotated power blades to enhance cooling efficiency.
SiFive is set to integrate Nvidia's NVLink Fusion into its datacentre-class designs, enhancing the capabilities for AI systems based on RISC-V architecture. This integration will combine advanced processing cores with scalable coherent fabrics.
Global semiconductor revenues are projected to surpass $1 trillion in 2026, driven by significant growth in memory and logic IC revenues. This surge is attributed to massive demand across various sectors.
The article discusses the unique challenges of Large Language Model (LLM) inference, particularly focusing on memory and interconnect issues rather than compute power. It proposes four architectural research opportunities to enhance memory capacity and communication speed in datacenter AI applications.
Marvell has made a significant investment in AI data center connectivity by acquiring XConn for $540 million. This move underscores Marvell's commitment to enhancing its capabilities in the rapidly growing AI sector.
Penguin Solutions has announced that its SMART Modular CXL NV-CMM E3.S 2T non-volatile memory module has achieved CXL compliance. This milestone underscores the company's commitment to adhering to industry standards in advanced memory solutions.
Cadence Design Systems has launched the first LPDDR5X 9,600 Mbits/s memory IP system solution designed for enterprise and data center applications. This solution integrates Cadence's memory IP with Microsoft's RAIDDR ECC algorithm to enhance reliability.