The article discusses the increasing complexity of PCB design due to the rise of heterogeneous multi-die designs. It emphasizes the importance of advanced analysis in addressing these challenges while maintaining a focus on complete system integration.
The article discusses the limitations of existing embodied carbon footprint models in the semiconductor industry, which fail to incorporate uncertainties in the supply chain. It introduces CarbonClarity, a probabilistic framework that allows for better modeling of these uncertainties and their impact on emissions.
The article introduces InterPUF, a new authentication framework designed for reconfigurable interposers in system-in-package platforms. It addresses trust challenges in decentralized environments by embedding a physically unclonable function and utilizing multi-party computation for secure authentication.
The article discusses the challenges hindering the widespread adoption of chiplets in semiconductor design. It offers insights into potential solutions that designers can implement to overcome these obstacles.
Cadence Design Systems has unveiled a partner ecosystem aimed at delivering pre-validated chiplet solutions based on its physical AI chiplet platform. Initial partners include notable companies such as Arm and Arteris, with the goal of streamlining the chiplet development process.
The article highlights several noteworthy developments in the semiconductor industry, including pre-validated chiplets, Furiosa AI's Renegade chip, and innovations in electric vehicle batteries. Additionally, it mentions a groundbreaking achievement in commercial in-space manufacturing.
Cadence has unveiled an ecosystem at CES 2026 that offers pre-validated packaged chiplets aimed at physical AI, data centers, and high-performance computing. This collaboration includes notable partners such as Arm and Arteris.
Francoise von Trapp is retiring from 3D InCites, leading to the conclusion of the 'Insights from the Leading Edge' (IFTLE) series. This marks the end of a significant era in semiconductor industry commentary and analysis.
The article discusses various advancements in semiconductor technology, including improvements in DDR5 memory and innovative techniques for chip integration and design. It highlights research on hybrid bonding, radiation effects, and new memory technologies like 2T-SOT-MRAM.
The article discusses how rapid feasibility exploration allows designers to assess critical factors such as IR drop, electromigration, and thermal impacts early in the design process for multi-die designs. This approach aims to minimize design risks and enhance confidence in the development of complex semiconductor architectures.
The article provides insights into recent advancements in microcontroller ecosystems, chiplet technology, and NFC-enabled security. It highlights a collaboration between Aptiv and Vecna Robotics aimed at enhancing autonomous mobile robots (AMRs) for industrial automation.
Imec and Japan’s ASRA have announced a strategic initiative to standardize chiplet architectures specifically for automotive applications. This alignment aims to enhance interoperability and efficiency in the automotive semiconductor sector.
The article discusses various innovative approaches in semiconductor technology, including chiplet designs for quantum processors and advancements in thermal management for battery electric vehicles (BEVs). It also highlights developments in photonic chips, processor fuzzing, and AI applications in quantum computing and hardware design automation.
The article discusses the economic advantages of chiplet architecture for automotive systems, highlighting the challenges of integrating complex electronic systems while keeping costs competitive. It contrasts traditional monolithic System-on-Chip designs with chiplet technology, which offers a more scalable solution for mass production in the automotive sector.
MZ Technologies has launched a new video series aimed at semiconductor and systems-design engineers, focusing on advanced packaging design. This initiative aligns with the industry's shift towards multi-die and 2.5D/3D integration technologies.
Arteris has acquired Cycuity, a hardware security specialist, to enhance the security of data movement for chip designers. This acquisition aims to bolster interconnect IPs for system-on-chips (SoCs) and chiplets.
The article discusses a new algorithm-driven approach to on-chip integration that aims to support numerous independent hardware designs efficiently. This method addresses the scalability issues faced by traditional multi-project wafer services in semiconductor design.
Researchers from the University of Innsbruck, Alpine Quantum Technologies, and Fraunhofer ISIT have published a paper on chiplet technology aimed at enhancing large-scale trapped-ion quantum processors. The focus is on integrating optical and electronic components to advance quantum information processing capabilities.
Marvell is focusing on connectivity as a critical factor in overcoming AI limitations, highlighting technologies like CXL, chiplets, and photonics. The company believes that enhancing connectivity will address the current bottlenecks in AI performance.
PowerLattice has developed new chiplets that miniaturize and repackage high-voltage regulators, claiming to reduce power consumption by up to 50% and double performance per watt. This innovation addresses inefficiencies in power delivery to GPUs in data centers, which can significantly increase energy requirements.