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Daily · Wednesday, November 26, 2025

Emerging optical technologies and AI chips dominate today's semiconductor landscape

Today's big story: funding is flowing into innovative optical technologies as companies like NcodiN and Q.ANT make headlines. You’ll want to keep an eye on co-packaged optics as it promises to revolutionize AI infrastructure with better performance and efficiency. Meanwhile, sustainability efforts are gaining traction with eco-friendly packaging solutions hitting the market.

Key Stories

Silicon photonic interposer start-up NcodiN raises €16m in seed funding

Summary

NcodiN has secured €16 million to advance its optical interposer technology.

Why this matters

• NcodiN's funding highlights growing investor interest in optical technologies for computing.
• Their integrated nanolasers could significantly enhance data processing speeds.
• This innovation is crucial for meeting the increasing demands of data centers and AI applications.

Co-Packaged Optics: Today’s Biggest Packaging Push

Summary

Co-packaged optics are emerging as a key trend in semiconductor packaging.

Why this matters

• This technology promises to boost bandwidth density and reduce latency, vital for AI workloads.
• Enhanced power efficiency could lead to lower operational costs for data centers.
• The shift towards co-packaged optics indicates a broader trend of integrating optics with traditional semiconductor solutions.

Q.ANT Raises Series A, Debuts Second-Gen TFLN Photonic Chip

Summary

Q.ANT has launched its second-generation TFLN photonic chip after securing Series A funding.

Why this matters

• The new chip aims to improve energy efficiency in AI computations, addressing a critical industry challenge.
• This development aligns with the growing demand for power-efficient solutions in AI applications.
• Q.ANT's progress underscores the importance of photonics in the future of semiconductor technology.

Paper component reel saves 80% CO2

Summary

Osram and Zumtobel Group have developed a sustainable paper alternative for component reels.

Why this matters

• This innovation could significantly reduce the environmental impact of semiconductor manufacturing.
• The shift to eco-friendly materials aligns with global sustainability goals in the tech industry.
• Companies adopting these practices may enhance their brand reputation and appeal to environmentally conscious consumers.

Charting the course for a truly multi-modal device edge

Summary

The industry is urged to innovate beyond traditional silicon solutions for edge AI capabilities.

Why this matters

• Transitioning to advanced architectures is essential for maximizing the potential of edge devices.
• This shift could lead to breakthroughs in performance and application diversity.
• Emphasizing multi-modal capabilities may attract new investments and partnerships in the semiconductor space.

Editor's Picks

Active current mirror

Summary

Woodward has introduced designs to enhance the precision of current mirrors.

Why this matters

• Improved current mirror designs could lead to better performance in a range of semiconductor applications.
• This innovation addresses a longstanding challenge in semiconductor design, enhancing overall efficiency.
• The advancements may attract attention from IoT and industrial automation sectors looking for precision solutions.

RANSemi hooks up with TechPhosis on small cells

Summary

RANsemi has partnered with TechPhosis to enhance small cell technology for 5G networks.

Why this matters

• This collaboration could accelerate the deployment of 5G infrastructure, critical for next-gen mobile applications.
• Leveraging Open RAN technology may lead to more flexible and cost-effective solutions in the telecom sector.
• The partnership highlights the ongoing evolution of network technologies in response to increasing data demands.